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? 2012-2016 microchip technology inc. ds60001303c-page 1 EQCO30T5.2 features compatible with all smpte3g sdi data rates: - smpte259m sdi, 143 to 360 mbps - smpte344m, 540 mbps - smpte292m hd-sdi, 1.485 gbps - smpte372m dual-link hd-sdi, 2.97 gbps - smpte424m dual-speed 3g-sdi, 2.97 gbps pin compatible with gennum and national semiconductor parts loss of signal detect at input, optional 3 db input trace/receive equalization also operates with 8b/10b coding single 3.3v supply. low power consumption (150 mw, 3.3v supply) output driver enable lf-uplink receiver included, receiving 5 mbps in full-duplex communication for cable lengths in 0-450m range up to 900 ma can be received for powering camera devices selectable slew rate for sd and hd/3g 16-pin, 0.65 mm pin pitch, 4 mm qfn package -40c to +85c industrial temperature range pb-free and rohs compliant applications high definition, high frame rate pro-video hd-sdi frame store surveillance, industrial/inspection, medical video inputs hdcctv applications introduction the EQCO30T5 is a video cable driver for 3g/hd/sdi video, with speeds up to 4.0 gbps. it is designed to be a direct replacement for competing cable drivers. in addition to downlink functionality from camera to frame grabber, it can also receive a 5 mbps uplink signal from the frame grabber to the camera. additionally, power can be provided over the same cable using the same chip and a few external components. the device operates with 8b/10b coded signals and with smpte signals up to 2.97 gbps. note: the EQCO30T5 cable driver can be used in combination with the eqco30r5 video equalizer. this device is capable of transmitting the uplink signal whilst other key parameters remain compliant to smpte specifications. please refer to the microchip web site ( www.microchip.com ) for the eqco30r5 data sheet. EQCO30T5.2 3g/hd-sdi video cable driver downloaded from: http:///
EQCO30T5.2 ds60001303c-page 2 ? 2012-2016 microchip technology inc. typical link performance table 1 , table 2 and table 3 give an overview of link performance (EQCO30T5 and eqco30r5 combined) at room temperature without using the uplink and without providing power over the same coax. when providing power or using the uplink communication to the camera, a small length penalty may arise (in cable length, typically 10%) due to added parasitics and noise. the uplink operates to at least 400m at the 5 mbps bit rate. table 1: belden typical link performance name belden 7731a belden 1694a belden 1505a belden 1505f belden 1855a type long distance industry standard compromise coax flexible thinnest cable diameter (mm) 10.3 6.99 5.94 6.15 4.03 270 mbps (m) 718 469 384 302 270 1.485 gbps (m) 332 223 187 136 132 2.97 gbps (m) 219 149 128 89 91 table 2: gepco typical link performance name gepco vhd1100 gepco vsd2001 gepco vpm2000 gepco vhd2000m gepco vdm230 type long distance industry standard compromise coax flexible thinnest cable diameter (mm) 10.3 6.91 6.15 6.15 4.16 270 mbps (m) 772 502 387 305 273 1.485 gbps (m) 372 241 187 138 133 2.97 gbps (m) 252 163 128 91 92 table 3: canare typical link performance name canare l-7cfb canare l-5cfb canare l-4cfb canare l-3cfb canare l-2.5cfb type long distance industry standard compromise coax thin cable thinnest cable diameter (mm) 10.3 6.99 5.94 6.15 4.03 270 mbps (m) 615 434 344 287 223 1.485 gbps (m) 281 201 161 135 109 2.97 gbps (m) 182 132 107 90 73 downloaded from: http:///
? 2012-2016 microchip technology inc. ds60001303c-page 3 EQCO30T5.2 table of contents 1.0 device overview ....................................................... ...................................................... ............................................................. 4 2.0 application information.................................................... ................................................. ............................................................ 8 3.0 electrical characteristics .......................................................... ........................................ .......................................................... 11 4.0 packaging................................................................................. .................................................................................................. 13 to our valued customers it is our intention to provide our valued customers with the best documentation possible to ensure successful use of your micro chip products. to this end, we will continue to improve our publications to better suit your needs. our publications will be refined and enhanced as new volumes and updates are introduced. if you have any questions or comments regar ding this publication, please contact the marketing communications department via e-mail at docerrors@microchip.com or fax the reader response form in the back of this data sheet to (480) 792-4150. we welcome your feedback. most current data sheet to obtain the most up-to-date version of this data s heet, please register at our worldwide web site at: http://www.microchip.com you can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page . the last character of the literature number is the versi on number, (e.g., ds30000000a is ve rsion a of document ds30000000). errata an errata sheet, describing minor operational differences fr om the data sheet and recommended workarounds, may exist for curren t devices. as device/documentation issues become known to us, we will publish an errata sheet. the errata will specify the revisi on of silicon and revision of document to which it applies. to determine if an errata sheet exists for a particular device, please check with one of the following: microchips worldwide web site; http://www.microchip.com your local microchip sales office (see last page) when contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. customer notification system register on our web site at www.microchip.com to receive the most current information on all of our products. downloaded from: http:///
EQCO30T5.2 ds60001303c-page 4 ? 2012-2016 microchip technology inc. 1.0 device overview the EQCO30T5 is a dual slew rate cable driver designed to drive digital signals over coaxial cable. the EQCO30T5 chip is optimized for driving smpte hd-sdi signals, but works equally well with 8b/10b coded signals. the eqco30r5 is a video equalizer that matches to the EQCO30T5, since it can transmit the uplink signal. implementing the uplink requires very few additional components on both sides of the link, and complies with smpte specifications. the eqco30r5 data sheet is available separately from microchip. figure 1-1 shows a typical communication link using the EQCO30T5 and eqco30r5 chips: figure 1-1: typical EQCO30T5 setup the EQCO30T5 includes an uplink receiver for receiving digital data coming from the frame store in full-duplex, giving 5 mbps of bandwidth for: triggering purposes, auxiliary outputs firmware upgrades, audio channels etc. up to 400 meters 75 coax high denition camera eqco 30t5 frame store + camera control up to 2.97 gbps downlink up to 5 mbps uplink up to 900 ma dc up to 900 ma dc eqco 30r5 up to 5 mbps uplink up to 2.97 gbps downlink downloaded from: http:///
? 2012-2016 microchip technology inc. ds60001303c-page 5 EQCO30T5.2 1.1 pinout and pin description figure 1-2: EQCO30T5.2 pin diagram (viewed from top) table 1-1: EQCO30T5.2 pin descriptions 1.1.1 sdip/sdin sdip/sdin together form a differential input pair. between sdip and sdin inputs, there is a termination resistor of 100 ? . the intention is to always use ac coupling. when ac-coupled, the common-mode gets biased to 600 mv. 1.1.2 rref a resistor is to be connected between vcc and the r ref pin. a resistor of 750 ? gives an 800 mv launch amplitude in the 75 ? coaxial cables. a larger resistor gives a smaller amplitude. 1.1.3 enable when enable is floating or pulled high, the output driver is enabled. when enable is low, the output is disabled and power consumption drops significantly. pin number pin name signal type description (tab) gnd power use as single-point ground. 1, 2 sdip, sdin differential input serial input positive/negative differential serial input. 3 gnd power ground. connect to gnd tab. 4r ref analog input input determining output amplitude of cable driver. 9 vcc power +3.3v of power supply. 6 enable input enables the output driver pins. 5, 7, 8, 13, 14 nc input do not connect; leave floating. used for internal testing. 10 sd/hdb input select edge rate. 11 sdon driver output serial negative cable driver output with 50 ? on-chip serial output resistance. complement with 25 ? externally. 12 sdop driver output serial positive cable driver output with 50 ? on-chip serial output resistance. complement with 25 ? externally. 15 lfout output digital output signal of the full-duplex uplink. 16 eqdis input disables input trace equalization. gnd tab 16 15 14 13 5 6 7 8 1 2 3 4 12 11 10 9 nc enable sdip vcc sd/hdb lfout sdon sdop EQCO30T5 gnd nc sdin rref eqdis nc nc nc downloaded from: http:///
EQCO30T5.2 ds60001303c-page 6 ? 2012-2016 microchip technology inc. 1.1.4 sd/hdb with sd/hdb set to high, the output rise and fall times are set for sd operation. when left floating or pulled low, the rise and fall times are set for 3g/hd operation. 1.1.5 sdon, sdop the output driver is not based on a cml output stage. both outputs operate independently, so there is very little interference between the outputs and their termination condition. there is also no lr- output network needed for achieving good return- loss. a 25 ? resistor should be connected in series with the output to drive a 75 ? coax cable. the output amplitude is achieved behind this 25 ? resistor; refer to the application circuits at the end of the data sheet. the pcb doesnt require layout changes when migrating from competing cable drivers, however, fewer components are needed. one does not need to optimize the return-loss network, since it is omitted. 1.1.6 lfout lfout provides the 5 mbps received uplink signal (lvttl voltage levels). it can easily drive a pcb trace of 20 pf at this speed. for longer distance communication from this pin to the next chip, using a buffer is recommended. the output impedance is about 300 ? . 1.1.7 eqdis when eqdis is left floating or pulled low, the input trace equalization is turned on and invokes a typical 3 db gain at 1.5 ghz. this value is optimized for compensating the high- frequency losses of approximately 20 cm of 5-mil stripline in fr4. when pulled high, this equalization is turned off. downloaded from: http:///
? 2012-2016 microchip technology inc. ds60001303c-page 7 EQCO30T5.2 1.2 circuit operation figure 1-3 is a block diagram of the EQCO30T5, showing electrical connections. the input pre-driver brings the input signal to a digital signal, with or without the use of input trace equalization. the active splitter/ combiner/driver launches the digital signal in the cable, with an amplitude determined by the external resistor connected to r ref and with an edge rate for sd or 3g/ hd-sdi depending on the sd/hdb signal. it also splits the incoming signal towards the lf receiver to provide the 5 mbps lf out signal. figure 1-3: EQCO30T5 bl ock diagram showing electrical connections EQCO30T5 active signal splitter/combiner/driver input pre-driver sdop sdip sdin lf receiver sdon eqdis enable sd/hd rref downloaded from: http:///
EQCO30T5.2 ds60001303c-page 8 ? 2012-2016 microchip technology inc. 2.0 application information 2.1 typical application circuit as smpte cable driver figure 2-1 illustrates a typical schematic implementation of the EQCO30T5 used as a cable driver for smpte video signals. figure 2-1: EQCO30T5.2 typical appl ication circuit as smpte cable driver resistors r8 and r9 are to be placed close to pins 12 and 11, respectively. from there onwards, the traces up to the coax connectors should be laid-out as 75 ? traces (including the c3 and c4 capacitors as ac-couplers). 2.1.1 return-loss network competing cable drivers need external rl return-loss networks. the EQCO30T5 does not need these type of external networks. figure 2-2 compares the output network of the EQCO30T5 with the network of competing cable drivers. the EQCO30T5 is pin-compatible with other cable drivers, but with a different component population. no termination resistor to vcc is required (do not fit = dnf). the inductor of the return loss network must not be populated and the 75 ? resistor of this network should be replaced with a 25 ? resistor to achieve correct operation. downloaded from: http:///
? 2012-2016 microchip technology inc. ds60001303c-page 9 EQCO30T5.2 figure 2-2: comparison between EQCO30T5 and competing solutions note: resistors marked dnf indicate do not fit downloaded from: http:///
EQCO30T5.2 ds60001303c-page 10 ? 2012-2016 microchip technology inc. 2.2 EQCO30T5 in bidirectional link (including power supply) figure 2-3: EQCO30T5 in bidirectional link (including power supply transmission) resistors r8 and r9 are to be placed close to pins 12 and 11, respectively. from there onwards, the traces up to the coax connector sdip1 should be laid out as 75 ? traces (including the c3 and c4 capacitors as ac cou- plers). resistor r1 has to be placed very close to this coax connector with a very short, low-impedance con- nection between one of the shielding pins of the con- nector and the resistor. to achieve the return-loss illustrated in the appendix, the power and ground planes below components fb1, fb2, r3, r4, l1, r5, l2 should be removed (applying cut-outs). 2.2.1 component recommendation when using the components below, a maximum cur- rent of 900 ma can be communicated to power-up the camera side. different types of inductors may be suit- able in order to allow a higher current level, however, the rf quality of the inductor should be checked. ferrite beads fb1, fb2 = fbmh1608hm102 from taiyo yuden inductor l1= 1812ps_103 from coilcraft downloaded from: http:///
? 2012-2016 microchip technology inc. ds60001303c-page 11 EQCO30T5.2 3.0 electrical characteristics 3.1 absolute maximum ratings stresses beyond those listed under this section may cause permanent damage to the device. these are stress ratings only and are not tested. functional operation of the device at these or any other conditions beyond those indicated in the operational sections are not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. table 3-1: absolute maximum ratings parameter conditions min. typ. max. units storage temperature -65 +150 c ambient temperature power applied -55 +125 c operating temperature normal operation (vcc = 1.2v 5%) -40 +85 c supply voltage to ground -0.8 +3.6 v dc input voltage -0.8 +3.6 v dc voltage to outputs -0.8 +3.6 v current into outputs outputs low 90 ma table 3-2: electrical characteristics (ove r the operating vcc and -40 to +85c range) parameter description min. typ. max. unit power supply vcc supply voltage 3.15 3.3 3.45 v i s supply current, both transmitting and receiving 45 ma operational bit rate br output bit rate cable driver output 0.05 4 gbps br uplink bit rate uplink receiver 0.5 5 mbps sdip/sdin input ? vi input amplitude v sdip,n 2x100 2x900 mv v cmin input common-mode voltage 600 mv r input differential input termination 2x50 ? downloaded from: http:///
EQCO30T5.2 ds60001303c-page 12 ? 2012-2016 microchip technology inc. 1: jitter numbers (over operating vcc range at -40c to +85c and full ? v tx range with pathological patterns) 2: measured with belden 1694a coaxial cable sdop connection to coax z coax coax cable characteristic impedance 75 ? r sdop , r sdon input impedance between sdop and vcc/gnd. to get to 75, add external 25 ? series resistor. 45 50 55 ? r loss return-loss as seen on sdop pin having 25 ? series resistor. frequency range = 5 mhz-1.5 ghz - 1 5d b r loss return-loss as seen on sdop pin having 25 ? series resistor. frequency range = 1.5 ghz-3.0 ghz - 1 0d b ? v tx transmit amplitude with r ref = 750 ? 720 800 880 mv t rise_tx_sd rise/fall time 20% to 80% of ? v tx (sd/hdb = high) 400 800 ps t rise_tx rise/fall time 20% to 80% of ? v tx (sd/hdb = low) 65 ps lfo output (lvttl-like) t rise_llfo rise/fall time 20% to 80% of v cc for 20 pf load 15 ns table 3-2: electrical characteristics (ove r the operating vcc and -40 to +85c range) (continued) table 3-3: jitter numbers ( 1 ) parameter conditions min. typ. max. units additive peak to peak jitter on sdop and sdon downlink signal = 3.0 gbps 1 0p s peak to peak jitter on lfo 0-450m ( 2 ) , @ low-speed signal = 5 mbps, 8b/10b, and @ downlink signal = 270 mbps, 8b/10b 5 0n s downloaded from: http:///
? 2012-2016 microchip technology inc. ds60001303c-page 13 EQCO30T5.2 4.0 packaging information 4.1 package marking information 16-lead plastic quad flat, no lead package 4x4x0.9 mm body [qfn] 16-lead qfn (4x4x0.9 mm) example pin 1 pin 1 eqco 30t5.2 yywwnnn yywwnnn legend: xx...x customer-specific information y year code (last digit of calendar year) yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week 01) nnn alphanumeric traceability code pb-free jedec ? designator for matte tin (sn) * this package is pb-free. the pb-free jedec designator ( ) can be found on the outer packaging for this package. note : in the event the full microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e downloaded from: http:///
EQCO30T5.2 ds60001303c-page 14 ? 2012-2016 microchip technology inc. b a 0.20 c 0.20 c (datum b) (datum a) c seating plane 1 2 n 2x top view side view bottom view for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging note: note 1 1 2 n 0.10 c a b 0.10 c a b 0.10 c 0.08 c microchip technology drawing c04-259b sheet 1 of 2 16-lead plastic quad flat, no lead package (8e) - 4x4x0.9 mm bod [qfn] d e 2x 16x (a3) a d2 e2 16x l 16x b e e 2 (16x k) a1 0.10 c a b 0.05 c downloaded from: http:///
? 2012-2016 microchip technology inc. ds60001303c-page 15 EQCO30T5.2 microchip technology drawing c04-259b sheet 2 of 2 for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging note: number of pins overall height terminal width overall width overall length terminal length exposed pad width exposed pad length terminal thickness pitch standoff units dimension limits a1 a b d e2 d2 a3 e l e n 0.65 bsc 0.20 ref 1.951.95 0.45 0.25 0.80 0.00 0.30 4.00 bsc 0.55 2.05 2.05 0.870.02 4.00 bsc millimeters min nom 16 2.152.15 0.65 0.35 0.950.05 max k 0.425 ref ref: reference dimension, usually without tolerance, for information purposes only. bsc: basic dimension. theoretically exact value shown without tolerances. 1.2. 3. noes: pin 1 visual index feature may vary, but must be located within the hatched area. package is saw singulated dimensioning and tolerancing per asme y14.5m terminal-to-exposed-pad 16-lead plastic quad flat, no lead package (8e) - 4x4x0.9 mm bod [qfn] downloaded from: http:///
EQCO30T5.2 ds60001303c-page 16 ? 2012-2016 microchip technology inc. recommended land pattern for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging note: dimension limits units c2 optional center pad width contact pad spacing optional center pad length contact pitch y2 x2 2.15 2.15 millimeters 0.65 bsc min e max 3.625 contact pad length (x16) contact pad width (x16) y1 x1 0.725 0.30 bsc: basic dimension. theoretically exact value shown without tolerances. notes: 1. dimensioning and tolerancing per asme y14.5m microchip technology drawing c04-2259a nom 16-lead plastic quad flat, no lead package (8e) - 4x4x0.9 mm bod [qfn] silk screen 12 16 c1 contact pad spacing 3.625 contact pad to center pad (x16) g1 0.20 c1 c2 y2 x2 y1 g1 x1 e downloaded from: http:///
? 2012-2016 microchip technology inc. ds60001303c-page 17 EQCO30T5.2 appendix a: revision history revision c (february 2016) removed electrostatic discharge ratings from table 3-1 . minor typographical changes. revision b (february 2015) updated the typical application circuit diagrams in figures 2-1 and 2-3 . revision a (september 2014) this is the initial release of the document in the microchip format. this replaces eqcologic document version 2v0. table a-1: version history version date author comments 2v0 1/27/14 a. peeters revision 1v0 3/13/12 a. peeters final document 0v2 1/17/12 m. kuijk added return-loss measurement 0v1 1/6/12 b. devuyst new document downloaded from: http:///
EQCO30T5.2 ds60001303c-page 18 ? 2012-2016 microchip technology inc. appendix b: typical return-loss measurement all measurements at vcc = 3.3v, temp = +25oc, data pattern = prbs15 (including 20 s of each polarity of pathological pattern), measured with belden 1694a cable. figure b-1: typical return-loss measurement (db vs mhz) downloaded from: http:///
? 2012-2016 microchip technology inc. ds60001303c-page 19 EQCO30T5.2 the microchip web site microchip provides online support via our web site at www.microchip.com . this web site is used as a means to make files and information easily available to customers. accessible by using your favorite internet browser, the web site contains the following information: product support C data sheets and errata, application notes and sample programs, design resources, users guides and hardware support documents, latest software releases and archived software general technical support C frequently asked questions (faqs), technical support requests, online discussion groups, microchip consultant program member listing business of microchip C product selector and ordering guides, latest microchip press releases, listing of seminars and events, listings of microchip sales offices, distributors and factory representatives customer change notification service microchips customer notification service helps keep customers current on microchip products. subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. to register, access the microchip web site at www.microchip.com . under support, click on customer change notification and follow the registration instructions. customer support users of microchip products can receive assistance through several channels: distributor or representative local sales office field application engineer (fae) technical support customers should contact their distributor, representative or field application engineer (fae) for support. local sales offices are also available to help customers. a listing of sales offices and locations is included in the back of this document. technical support is available through the web site at: http://microchip.com/support downloaded from: http:///
EQCO30T5.2 ds60001303c-page 20 ? 2012-2016 microchip technology inc. product identification system to order parts, including industrial, or obtain information, for e.g., on pricing or delivery, re fer to the factory or the list ed sales office . part no. xxx rm radio firmware device device: EQCO30T5.2 temperature range: i = -40 ? cto+85 ? c (industrial temperature) package: tray = tray (blank) = tube examples: a) EQCO30T5.2 = industrial temperature, 16-lead qfn tube packaging b) EQCO30T5.2-tray = industrial temperature, 16-lead qfn tray packaging i temp. range module revision number f f downloaded from: http:///
? 2012-2016 microchip technology inc. ds60001303c-page 21 information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safety applications is entirely at the buyers risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting from such use. no licenses are conveyed, implicitly or otherwise, under any microchip intellectual property rights unless otherwise stated. trademarks the microchip name and logo, the microchip logo, anyrate, dspic, flashflex, flexpwr, heldo, jukeblox, keeloq, keeloq logo, kleer, lancheck, link md, medialb, most, most logo, mplab, optolyzer, pic, picstart, pic32 logo, righttouch, spynic, sst, sst logo, superflash and uni/o are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. clockworks, the embedded control solutions company, ethersynch, hyper speed control, hyperlight load, intellimos, mtouch, precision edge, and quiet-wire are registered trademarks of microchip technology incorporated in the u.s.a. analog-for-the-digital age, any capacitor, anyin, anyout, bodycom, chipkit, chipkit logo, codeguard, dspicdem, dspicdem.net, dynamic average matching, dam, ecan, ethergreen, in-circuit serial programming, icsp, inter-chip connectivity, jitterblocker, kleernet, kleernet logo, miwi, motorbench, mpasm, mpf, mplab certified logo, mplib, mplink, multitrak, netdetach, omniscient code generation, picdem, picdem.net, pickit, pictail, puresilicon, righttouch logo, real ice, ripple blocker, serial quad i/o, sqi, superswitcher, superswitcher ii, total endurance, tsharc, usbcheck, varisense, viewspan, wiperlock, wireless dna, and zena are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of microchip technology incorporated in the u.s.a. silicon storage technology is a registered trademark of microchip technology inc. in other countries. gestic is a registered trademar ks of microchip technology germany ii gmbh & co. kg, a subsidiary of microchip technology inc., in other countries. all other trademarks mentioned herein are property of their respective companies. ? 2012-2016, microchip technology incorporated, printed in the u.s.a., all rights reserved. isbn: 978-1-5224-0256-5 note the following details of the code protection feature on microchip devices: microchip products meet the specification cont ained in their particular microchip data sheet. microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip products in a manner outside the operating specif ications contained in microchips data sheets. most likely, the person doing so is engaged in theft of intellectual property. microchip is willing to work with the customer who is concerned about the integrity of their code. neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as unbreakable. code protection is constantly evolving. we at microchip are co mmitted to continuously improvin g the code protection features of our products. attempts to break microchips code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the company?s quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified. quality management s ystem certified by dnv == iso/ts 16949 == downloaded from: http:///
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